张润世

个人简介:张润世,男,在读博士。于2018年毕业于北京航空航天大学机械工程及自动化学院,取得机械工程专业学士学位。2022年毕业于北京航空航天大学机械工程及自动化学院机电系,取得机械工程专业硕士学位。2022年至今,于北京航空航天大学机械工程及自动化学院机器人所攻读博士学位

研究方向:深度学习赋能的医学影像处理,具体研究领域为:1、术前影像建模;2、自动手术规划;3、手术效果预测。具体研究对象包括:CT,MRI,超声图像,点云等。

Email:zhangrunshi@buaa.edu.cn

其他主页:ORCiDGoogle scholarGithubWeb of science

一作论文:JCR一区6篇,其中中科院 一区TOP 2篇,二区TOP 1篇,包括医学影像领域内知名期刊MedIA, IEEE TMI, IEEE JBHI, CIBM.

  1. Runshi Zhang, Bimeng Jie, Yang He, Junchen Wang*. TCFNet: Bidirectional face-bone transformation via a Transformer-based coarse-to-fine point movement network, Medical Image Analysis, Volume 105, 103653, 2025, https://doi.org/10.1016/j.media.2025.103653.(Q1, IF=11.8, 中科院1区 Top
  2. Zhang, Runshi and Mo, Hao and Wang, Junchen* and Jie, Bimeng and He, Yang and Jin, Nenghao and Zhu, Liang, “UTSRMorph: A Unified Transformer and Superresolution Network for Unsupervised Medical Image Registration,” in IEEE Transactions on Medical Imaging, vol. 44, no. 2, pp. 891-902, Feb. 2025, doi: 10.1109/TMI.2024.3467919.(Q1, IF=9.8, 中科院1区 Top
  3. Zhang, Runshi and Jie, Bimeng and He, Yang and Zhu, Liang and Xie, Zefeng and Liu, Zhan and Mo, Hao and Wang, Junchen*, “Craniomaxillofacial Bone Segmentation and Landmark Detection Using Semantic Segmentation Networks and an Unbiased Heatmap,” in IEEE Journal of Biomedical and Health Informatics, vol. 28, no. 1, pp. 427-437, Jan. 2024, doi: 10.1109/JBHI.2023.3337546.(Q1, IF=6.8, 中科院2区Top
  4. Runshi Zhang, Hao Mo, Weini Hu, Bimeng Jie, Lin Xu, Yang He, Jia Ke, Junchen Wang*, Super-resolution landmark detection networks for medical images, Computers in Biology and Medicine, Volume 182, 2024, 109095, https://doi.org/10.1016/j.compbiomed.2024.109095.Q1, IF=6.3, 中科院2区
  5. R. Zhang, J. Wang* and C. Chen*, Automatic implant shape design for minimally invasive repair of pectus excavatum using deep learning and shape registration, Computers in Biology and Medicine, 158, 2023(Q1, IF=6.3, 中科院2区
  6. R. Zhang, X. Guo and M. He, “Intelligent Pseudo Solder Detection in PCB Using Laser-Pulsed Thermography and Neural Network,” in IEEE Sensors Journal, vol. 22, no. 1, pp. 631-638, 1 Jan.1, 2022, doi: 10.1109/JSEN.2021.3129064.(Q1, IF=4.5, 中科院3区